8 SFF Front View – 8 SFF + optional Universal Media Bay, optical drive, Display Port, USB2.0 and SAS drives shown

1.

Drive support label

8.

iLO Service port

2.

Serial number/iLO information pull tab

9.

Power On/Standby button and system power LED

3.

Quick removal access panel

10.

Health LED

4.

Universal Media Bay (optional):

11.

NIC status LED

· Option: Optical drive bay + Display port & USB 2.0 port kit (shown)

· Option : 2SFF 24G x4 NVMe/SAS (TriMode) U.3 BC Cage

12.

Unit ID button/LED

13.

USB 3.2 Gen1 port

14.

Drive bays; optional backplanes:

5

Display Port (optional – shown)

· Option: 8 SFF 24G x1 NVMe/SAS (TriMode) U.3 BC

· Option: 8 SFF 24G x4 NVMe/SAS (TriMode) U.3 BC

6

Optical drive (optional – shown)

7

USB2.0 port (optional)

Notes: Optional- Systems Insight Display (SID) module is available for 8SFF CTO Server, and will be installed at the left-hand side of iLO Service port and USB 3.2 Gen1 port.

4 LFF Front View – 4 LFF + optional Optical drive, Display Port, USB2.0 and SAS drives shown

1.

Drive support label

7

iLO Service Port

2.

Optical drive (optional – shown)

8.

Power On/Standby button and system power LED

3.

Serial number/iLO information pull tab

9.

Health LED

4.

Quick removal access panel

10.

NIC status LED

5.

Option: Display port & USB 2.0 port bundle Kit (blank shown)

11.

Unit ID button/LED

6.

USB 3.2 Gen1 port

12.

SAS/SATA drive bays (12G x1 SAS LP BP embedded)

Notes: Systems Insight Display (SID) module is not available in 4LFF CTO Server.

20 EDSFF Front View – 20 E3.s 1T NVMe drives shown

1.

Drive support label

6.

Health LED

2.

Serial number/iLO information pull tab

7.

NIC status LED

3.

Quick removal access panel

8.

Unit ID button/LED

4.

iLO Service Port

9.

USB 3.2 Gen1 port

5.

Power On/Standby button and system power LED

10.

EDSFF drive bays (32G x4 NVMe BP embedded)

Internal View - Standard for all DL360 Gen11

1.

Liquid Cooling Module connector

13.

System Battry

2.

x8 SlimSAS ports (1A to 4A, 1B to 4B)

14.

Primary (CPU1) Riser PCIe 5.0

3.

DDR5 DIMM Slots (fully populated 32 DIMMs shown)

· 1x 16 FH and 1x16 LP slots

4.

Socket 2 MCIO ports (1 & 2)

15.

OCP Slot port

5.

Backplane Power connector

16.

Front Display Port and USB 2.0 connector (optional feature)

6.

Internal USB port (top USB 3.2 Gen1 and bottom USB 2.0)

17.

LP SlimSAS ports (1 & 2)

7.

Redudant Power Supply (1 & 2 as shown)

18.

Chipset

8.

Secondary (CPU 2) Riser PCIe 5.0

19.

Front I/O and USB 3.2 Gen1 connector

· Option: Low Profile x16

· Option: Full height x16 (lose Slot 2 on Primary Riser)

20.

SATA Optical port

21.

Socket 1 MCIO connector

9.

SID connector (optional feature, 8SFF only)

22.

CPU 1 (bottom) and CPU 2 (top) (shown with High Performance Heatsink)

10.

Energy Pack connector

23.

Hot plug (dual rotor) High Performance Fan Kit (7 fans)

11.

OCP Slot port

· Option: Closed-loop Liquid Cooling Heat Sink Fan FIO Bundle Kit

12.

HPE NS204i-u NVMe Hot Plug Boot Optimized Storage Device (optional – shown)

24.

HPE Hybrid Capacitor or HPE Storage Battery holder

Rear View - Standard for all DL360 Gen11

1.

Slot 1 x16 PCIe 5.0 – Full Height

6.

OCP 3.0 Slot 2: x16* PCIe 5.0^1,2 (Requires 2^nd Processor) Notes: *x8 for 20EDSFF CTO Server (requires 2^nd Processor)

2.

Slot 2 x16 PCIe 5.0 – Low Profile*

Notes: *Shown with optional hot-plug NS204i-u Boot Device (cabled, PCIe connection is not required)

7.

Serial port (optional -  shown)

3.

Option: Slot 3 x16 PCIe 5.0 (Requires 2^nd processor)

8.

iLO Management Port

· Low Profile and Full Height options

9.

USB 3.2 Gen1 Ports

4.

Redundant Power Supply (1 & 2 as shown)

10.

Uint ID Indicator LED

5.

Video (VGA) port

11.

OCP 3.0 Slot 1: x16* PCIe 5.0²

Notes: *x8 for 20EDSFF CTO Server

Notes:

- ¹ Supports various NICs, up to 200GbE

- ² Or supports each slot with x8 PCIe 5.0 under one processor, with the selection of "P51911-B21, CPU1 to the "OCP2 x8 Enablement Kit".

What’s New

· All new DL360 Gen11 server

· New 4th Generation Intel® Xeon® Scalable Processors (Extreme Core Count die/ XCC die; Medium Core Count/ MCC; High Bandwidth Memory/ HBM)

· New PCIe 5.0 support

· New HPE DDR5 SmartMemeory – Registered (RDIMM), 4800MT/s

· New HPE Gen11 Storage Controllers

· New HPE NS204i-u Gen11 NVMe Hot Plug Boot Optimized Storage Device

· New HPE Storage SSD and HDD support

· New HPE iLO6 support

· Nvidia A2 and L4 GPU support

· New Intel® Virtual RAID on CPU (Intel® VROC) Premium & Standard FIO Software for HPE

· New 4th Generation Intel® Xeon® Scalable Processors (Medium Core Count die/ MCC die)

· New DL360 Gen11 Standard Heatsink & Standard Fan Kit

· New DL360 Gen11 20EDSFF NC CTO Server

· New DL360 Gen11 Pre-Configured Models

· New HPE NVMe EDSFF E3.s 1T SSD

· New HPE Self-encrypting Drives

· HPE 500W Flex Slot Platinum Hot Plug Low Halogen Power Supply Kit

· HPE 800W Flex Slot Titanium Hot Plug Low Halogen Power Supply Kit

· HPE 1600W Flex Slot -48VDC Hot Plug Power Supply Kit

· HPE ProLiant DL360 Gen11 Direct Liquid Cooling solution

· HPE ProLiant for vSAN

· HPE Azure Stack HCI

· OpenBMC Capable through iLO6 Transfer of Ownership Process

· HPE 96GB Dual Rank x4 DDR5-4800 Registered Smart Memory Kit

· HPE 1800W-2200W Flex Slot Titanium Hot Plug Power Supply Kit

· HPE ProLiant DL3xx Gen11 Cache Mode for HBM Memory Mode setting from factory installation

Platform Information Máy chủ HPE ProLiant DL360 Gen11 Silver 4416+ RAM 32GB DDR5 MR408i-o NC 8SFF 2.5in - P60734-B21

Form Factor

· 1U rack

Chassis Types

· 20 EDSFF Carrier 1T (EC1) drive bays: 32G x4 NVMe (PCIe5.0 E3.s 1T)

· 8 SFF Basic Carrier (BC) drive bays:

- 24G x1 NVMe/SAS (TriMode) U.3 (PCIe4.0) or

- 24G x4 NVMe/SAS (TriMode) U.3 (PCIe4.0)

· With options for additional 2 SFF BC drive bays: 24G x4 NVMe/SAS (TriMode) U.3 (PCIe4.0)

· With options for additional optical drive, 1x USB3.2 Gen1 and 1x Display Port

· 4 LFF Low Profile (LP) drive bays: 12G x1 SAS/SATA

· With additional options for optical drive, 1x USB3.2 Gen1, and 1x Display Port

System Fans

· For 4 LFF and 8+2 SFF chassis

- Choice of 1P (one processor) Standard Fan Kit, 2P (two processors) Standard Fan Kit, Performnace Fan Kits and Closed-loop Liquid Cooling Heatsink Fan FIO Bundle Kit

· For 20 EDSFF chassis

- Choice of Performance Fan Kits and Closed-loop Liquid Cooling Heatsink Fan FIO Bundle Kit

Maximum Storage Máy chủ HPE ProLiant DL360 Gen11

Integrated video standard

· Video modes up to 1920 x 1200 @ 60 Hz (32 bpp)

· 16 MB Video Memory

HPE iLO 6 on system management memory

· 32 MB Flash

· 8 Gbit DDR4 with ECC protection

Memory Population guidelines

Front End / HPE ProLiant DL360 Gen11

Notes:

- Listed below are general Memory Module Population Rules supported by the processor for reference.

- There is no longer a need to install DIMMs in pairs in non-RAS modes.

- The same information is displayed alternatively by rank, by speed, or by qty. That is, when viewing by rank, selecting a particular rank will then show the DIMM qty vs DIMM speed tradeoff/combinations. All DIMMs must be either all DDR5 DIMMs or DDR5 and Crow Pass DIMMs.

- There should be at least one DDR5 DIMM per socket.

- When one DIMM is used in a channel, it must be populated in DIMM slot farthest away from the CPU (DIMM slot 0) of a given channel.

- For 16 + 0 configuration with 1R + 2R mixed rank population, on each channel always populated the higher electrical load (2R) in DIMM0 followed by single rank DIMM in DIMM1.

- A maximum of 8 logical ranks (ranks seen by the host) per channel is allowed.

- For a DDR5 DIMM and Crow Pass DIMM in a channel, the DDR5 DIMM must be populated in the farthest DIMM slot (0), while CPS has to be in the nearest slot (1).

- All DIMMs in a Processor socket must have the same number of ranks (unless explicitly specified otherwise).

- x8 DIMMs and x4 DIMMs cannot be mixed in the same channel or same Processor socket.

- Mixing of non-3DS and 3DS RDIMMs is not allowed in the same channel, across different channels, and across different sockets.

- 9x4 RDIMMs cannot be mixed with another DIMM types (Crow Pass 10x4RDIMMs or Non 9x4 RDIMMs).

- All DDR5 DIMMs must operate at the same speed per Processor socket.

- Rank mixing is not allowed on a channel except for Standard RDIMM 1 Rank + 2 Rank combination, when all 16 DIMMs for a Processor socket is populated.

- Mixing vendor is allowed for RDIMMs, but it is not allowed for 3DS RDIMMS

Notes:

- Ommited DIMM counts/socket not qualified by Intel.

- ¹ Supports SGX (Software Guard Extensions)

- ² Support Hemi (hemisphere mode).

General Memory Population Rules and Guidelines

· DIMMs should be installed in quantities of even numbers.

· Install DIMMs only if the corresponding processor is installed.

· If only one processor is installed in a two-processor system, only half of the DIMM slots are available.

· To maximize performance, it is recommended to balance the total memory capacity between all installed processors.

· When two processors are installed, balance the DIMMs across the two processors.

· White DIMM slots denote the first slot to be populated in a channel.

· Mixing of DIMM types (UDIMM, RDIMM, and LRDIMM) is not supported.

· The maximum memory speed is a function of the memory type, memory configuration, and processor model.

· The maximum memory capacity is a function of the number of DIMM slots on the platform, the largest DIMM capacity qualified on the platform, and the number and model of installed processors qualified on the platform.

Notes: The maximum memory speed is a function of the memory type, memory configuration, and processor model.

4 LFF device bay numbering

8 SFF + 2 SFF (optional) device bay numbering

8 SFF+ ODD device bay (optional through Media Bay)

20 EDSFF device bay numbering